On 29 May 2025, twenty-eight participants—including 25 students and 3 academic staff—from the Faculty of Artificial Intelligence and Engineering (FAIE) embarked on a captivating industrial visit to Amkor Technology Malaysia, located in Teluk Panglima Garang. Organised by the Industrial Linkage Committee (ILC), the visit was designed to offer students a meaningful connection between academic learning and real-world engineering applications.

The day began with an informative and engaging technical session led by Mr. Tan Boo Wei, Director of R&D, and Dr. Tan Chin Joo, Senior R&D Engineer. Their talk provided valuable insights into Amkor’s corporate direction and ongoing innovations in semiconductor packaging. The session sparked lively discussions and encouraged students to reflect critically on the evolving role of engineering in industry.

A guided facility tour followed, led by Dr. Yeo Siang Miang, Senior Engineer. The participants had the rare opportunity to observe the inner workings of key manufacturing stages such as marking, dicing, wire bonding, moulding and encapsulation, final testing, and interconnects. Witnessing these sophisticated processes firsthand brought textbook concepts to life, highlighting the precision and technological depth involved.

This industrial visit proved to be more than just a tour—it was an eye-opening journey into one of the world’s key technology providers. The experience not only deepened students’ technical understanding but also broadened their perspectives on future career opportunities in high-tech manufacturing and R&D. Such initiatives by the ILC continue to play a crucial role in preparing FAIE students to become industry-ready engineers equipped with both academic knowledge and practical exposure.